Top tier smartphone manufacturers may be looking to get a little more out of their tech. Apple, Samsung, and HTC are reportedly all interested in adopting more power efficient smartphones that will take advantage of some form of liquid cooling.
According to a report from Digitimes, all three companies are looking into adopting “ultra-thin heat pipes” in their respective next-generation handsets. The cooling mechanism is said to be similar to the ones currently seen in laptops, which are used to carry the heat away from processors and wireless chips.
The switch to liquid cooling over traditional air convention would be far more efficient for handset manufacturers. The reason for this is that water boasts greater thermal conductivity and higher specific heat capacity than air, meaning that water’s physical properties allowing it to transfer more heat than air while simultaneously remaining cooler in the process.
The technology appears to already feasible as NEC has recently released such a device known as the Medias X06E. The 4.7-inch handset already incorporates a heat pipe system with a slim 0.6mm diameter, far slimmer than the traditional 1-1.2mm diameter pipes seen in most notebooks.
According to Digitimes, Apple, Samsung, and HTC are all currently working on handsets with liquid cooling systems beginning and handsets are expected to surface as early as the fourth quarter of 2013.