The new Palm Tungsten PDA series from Palm are expected to start selling on Monday October 28. The new Palm Tungstens will feature Palm OS 5.0 and be aimed at enterprise purchasers. It is expected these devices will be announced Monday in New York during Palm’s 2002 Analyst Day presentation series beginning 8 a.m. EST.
During this presentation on Monday Palm will announce the release of its Tungsten Mobile Information Management Solution, a platform that will offer secure wireless e-mail and groupware access. Palm has so far only indicated that the Tungsten software solution would be made available for the Palm i705 wireless device and has denied any pending release of new products. However, sources say that two new Tungsten devices will be announced and released at the same time the Tungsten application platform is announced. Following are the expected technical specs for the Tungsten T and Tungsten W (wireless) devices:
OS : PalmOS 5.0,
Processor: 32-bit RISC, Texas Instruments’ 175-MHz OMAP1015 ARM chip, along with a TI digital signal processor (TI chip in both Tungsten devices)
Expansion: Secure Digital
Screen Resolution: 320 x 320 pixel
Dimensions: 4in when open, 3.6in when closed (lower part will snap open to reveal a space for writing with a stylus or using onscreen keypad)
Price: about $500.
One of the Tungsten devices will be a high-end device focused on handheld applications, meanwhile the other will be a GSM/GPRS smartphone, similar to Handspring’s Treo device. This wireless-centric device, in addition to the TI 1015 chip, will has TI’s GSM/GPRS chipset for wide-area cellular connectivity. Both Tungstens are expected to offer Bluetooth connectivity for interfacing with computers and other devices, and a slot for optional IEEE 802.11B wireless access.
Palm Tungstend T specs (handheld application focused device)
Palm Tungsten W specs (wireless focused device)