PDA News – Samsung i550 cancelled, PalmOne rumors, WiFi sleds delayed?

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Sprint cancels plans for i550

Well gee, here’s a shocker. After being delayed for almost a year, it appears that Sprint has terminated any plans to carry the Samsung i550 Palm OS phone. Unsurprising, since the i550 was outdated when it was announced, and a year’s delay didn’t make it any fresher. Such is the epitaph of many a converged device. Sprint’s reported reason for the decision was that they want to focus on the Treo 650 and their new Windows Smartphones.

http://sprintpcsinfo.com/modules.php?name=News&file=article&sid=810&mode=thread&order=0&thold=0

 

Rumors of PalmOne device with foldable screen

Within the last week, rumors have been circulating that PalmOne may be readying a device with a foldable screen, probably as an addition to the Treo line of smartphones.

To be blunt, these rumors are almost certainly false. They were started recently because two of PalmOne’s engineers were granted U.S. patent #6,850,780, “Compact palmtop computer system and wireless telephone with foldable dual-sided display.” This sparked speculation that PalmOne was going to produce some kind of Treo with a foldable screen. However, the patent was originally filed for in January of 2001. This isn’t the result of PalmOne patenting some sudden technological breakthrough.

U.S. Patent Office page for 6,850,780

 

Report: Enfora WiFi sleds for Treo line delayed

It appears that the projected early Febuary release date for Enfora’s Treo 600 WiFi sled may slip a little. Reports are reaching us that the release of the sled has been delayed. New dates are hazy, but March has been mentioned as a possibility. A sled for the Treo 650 is also in the works, originally slated for release thirty days after the 600 sled.

 

PalmSource, TI produce Cobalt reference designs

In an attempt to spur development of new Palm-powered smartphones–and adoption of Palm OS Cobalt–PalmSource and TI have teamed up to produce two ‘reference designs’ for Cobalt powered smartphones running on TI chips. PalmSource and TI will both be demonstrating the designs during the 3GSM World Congress, Febuary 14th through the 17th. Details on the designs are scant though, and hard to find through the heavy marketing flak.

It should be noted that these designs aren’t ‘real’ hardware, at least in the sense that they will ever see serious production or a life outside of trade shows. If any functioning hardware even exists, it’s likely to be only a few prototypes.

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